标题:
Hermetic sealing using tin-containing inorganic material with low sintering temperature
当前申请(专利权)人:
CORNING INCORPORATED
发明人:
AITKEN, BRUCE | QUESADA, MARK
简单同族:
CN101256970A | EP1965453A2 | EP1965453A3 | JP2008240150A | KR1020080080019A | TW200915637A | TWI472078B | US20080206589A1